Engineering publications brought to you by Mark Allen

Electronics

Marvell develops advanced packaging platform for custom AI accelerators

Archer’s gFET biochip integrates with electrical readout circuitry on silicon chip

xMEMS extends µCooling fan-on-a-chip to SSDs

Aeluma and Thorlabs unveil large-diameter photonics wafer manufacturing platform

US now seeks curbs on chip design software

Yokogawa releases SL2000 high-speed data acquisition unit

Infineon launches new radiation hardened GaN transistors

Nvidia once again beats Wall Street expectations

AMD acquires photonics startup Enosemi

Could immersive content stretch wireless networks to breaking point?

EnSilica establishes new engineering hub in Cambridge

TSMC to open its first European Design Centre in Munich in Q3 2025