Engineering publications brought to you by Mark Allen

Memory

Marvell develops advanced packaging platform for custom AI accelerators

xMEMS extends µCooling fan-on-a-chip to SSDs

SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU

Global semiconductor CapEx rises 27% in Q1, according to SEMI

sureCore extends sureFIT to include custom memory solutions for AI applications

Renesas extends RZ/A MPU line-up with RZ/A3M for HMI solutions

KIOXIA unveils NVMe SSD based on 8th Generation BiCS FLASH TLC

Rambus makes chipsets available for next-generation AI PC memory modules

Codasip looks to accelerate CHERI adoption

Microchip expands data centre connectivity, storage and compute portfolios

Cadence enables next-gen AI and HPC systems with ‘fastest’ IP memory system solution

Samsung set to end DDR4 production in the face of Chinese competition