Engineering publications brought to you by Mark Allen

Semiconductors

Marvell develops advanced packaging platform for custom AI accelerators

Archer’s gFET biochip integrates with electrical readout circuitry on silicon chip

Aeluma and Thorlabs unveil large-diameter photonics wafer manufacturing platform

SEGGER partners with Allegro MicroSystems to support high-performance MCUs

EnSilica establishes new engineering hub in Cambridge

TSMC to open its first European Design Centre in Munich in Q3 2025

SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU

Are reconfigurable AI ICs the future?

300mm RF silicon interposer platform paves the way for advanced RF and mixed-signal applications

Reports suggest Asahi Kasei plans to cut PIMEL shipments

Global semiconductor CapEx rises 27% in Q1, according to SEMI

GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation