Engineering publications brought to you by Mark Allen

Space

High Flying Junk

Infineon launches new radiation hardened GaN transistors

EnSilica unveils dual-beam, dual-polarisation Ku-band analogue beamformer chipset

Foxconn to open Europe’s first fan-out wafer level packaging plant

NEXT Semiconductor and BAE Systems to develop next generation space-qualified chips

Putting the building blocks in place

E-band in space

Companies forge alliance for quantum-secure satellite communications

Frontgrade Gaisler and wolfSSL look to enhance space cybersecurity

EU Project to deliver breakthrough in space imaging sensing

Mouser stocking Apogee Semiconductor's rad-hardened LEO A-Grade ICs

ESA and EnSilica partner to enable fully integrated ASICs for resilient GNSS