Engineering publications brought to you by Mark Allen

Electronics

ARIES starts volume production of the M100PFS SoM

EPC announces radiation-hardened eGaN transistors and ICs

NXP offers beta UWB development tools for U1 chip supported products

Point 2 Technology introduces RangeXtender for 5G networks

NHN selects Graphcore IPU-PODs

Ranovus announces second-generation “co-packaged optics” chip

"Game changer" for optical telecom and data centre interconnect networks

Solutions for high EMC requirements

Silicon carbide MOSFET module solutions for charging EVs

How SoCs can support the 5G revolution

TT Electronics launches S-2CONNECT Creo SOM

InP lasers integrated into photonics process