Engineering publications brought to you by Mark Allen

Electronics

Soil health intelligence achieved

NXP brings GaN to 5G multi-chip modules

Anritsu, Spirent and TOYO develop solution for evaluating 5G video quality

Qualcomm looks for mmWave boost

650V Silicon Carbide Schottky Diodes

Rear panel mount options for Harwin's hi-rel cable connector products

OMC delivers flexible fibre optic housing

Teledyne expands technical support for its ADC series

Chipset specific IPDs can help to simplify development of IoT applications

Porotech raises £3m for new generation of microdisplays

Ceva unveils ultra-wideband platform IP

Cadence and Presto Engineering collaborate on IC packaging