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Electronics
Kalray and Pliops announce plans to merge
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Farnell and Transphorm sign global SuperGaN distribution agreement
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Navitas’ Gen-3 Fast SiC MOSFETs to accelerate AI growth & EV charging
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Apollo to acquire stake in Intel’s Fab 34 in Ireland
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Rapidus and IBM extend chiplet packaging collaboration
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TSMC considered moving fabs out of Taiwan
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Blogs
05 Jun 2024
Codasip introduces latest RISC-V core for power-efficient applications
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SureCore unveils low power cryogenic memory technology
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05 Jun 2024
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