Engineering publications brought to you by Mark Allen

Laura Hopperton

RF & Microwave

TI creates its own IoT ecosystem

Memory

Microchip has EEPROM device for DDR4 SDRAM modules

Power

DC/DC converters integrate 50V, 2A internal switches

Global semi sales climb 5%

Automotive

Battery sensor combines MCU and CAN protocol module

Consumer

IoT drives sensor market rebound

Embedded Software

ARM moves to open source LLVM for future compilers

CPUs

Freescale has chip for cheaper head-up displays

RF & Microwave

Rohm teams with imec on ultra low power radio

Communications Hardware

Fibre optic modules enable long distance communication

Global semi sales up 11% year-on-year

Medical & Healthcare

Transient electronics dissolve on command