Engineering publications brought to you by Mark Allen

Board Level Design

KYOCERA AVX releases supercapacitor simulation software

OKI develops PCB technology with significantly improved heat dissipation

RS DesignSpark unveils PCB software upgrade backed by Infineon

CELUS and Blues partner to drive next-generation electronic design

Cadstrom raises $6.8m to fund streamline validation for electronic hardware design

QPT develops power electronics packaging with better heat removal and greater reliability

Taoglas AntennaXpert helps engineers select optimal antenna solution

Forefront RF secures £16m to power next-gen connectivity solutions

Board Level Design Products

EPC presents the EPC91200, a versatile motor drive inverter reference design

Micro RF connector offers enhanced board design flexibility

Murata introduces cutting-edge stretchable printed circuit for medical wearables

Board Level Design Features

A recipe for success

The unsung hero

The crucial component