Engineering publications brought to you by Mark Allen

Semiconductors

Littelfuse completes 200mm wafer fab acquisition

Rapidus begins installation of Japan's first NXE:3800E EUV lithography machinery

X-FAB presents streamlined SiC processes for faster custom MOSFET development

TSMC sets up 2nm pilot line with production due to start in 2026

MediaTek unveils the Dimensity 8400 for premium smartphones

sureCore teams up with Sarcina to package cryo chips

Frontgrade Gaisler licenses BrainChip’s Akida IP for deployment in space

DigiKey signs global distribution partnership agreement with MediaTek

Semiconductors Products

Microchip expands PolarFire FPGA and SoC solution stacks

ST boosts AI at the edge with NPU-accelerated STM32 microcontrollers

Synaptics extends Veros IoT connectivity family with dual-core SoC

Semiconductors Features

More demanding smartphone experiences drive innovation

Shaping the future of electronics and software design in 2025

Reaching for a better grip with robots