Engineering publications brought to you by Mark Allen

Neil Tyler

Communications

SCALINX secures €34m in second round funding

Artificial Intelligence

SEMIFIVE collaborates with HyperAccel in developing AI chip

EDA & Design Software

SEGGER’s Embedded Studio v8.10. supports both Arm and RISC-V

Electronics

Infineon strengthens multi-sourcing strategy with new SiC supplier agreement

Electronics

EU moves to back battery and green tech factories

Automotive

CES 2024 - NXP announces extension of its 28nm RFCMOS radar one chip family

Security

Alif Semiconductor delivers advanced on-chip security solution

Internet of Things

Wi-Fi HaLow platform looks to redefine IoT connectivity

Robotics & UAVs

SiLC Technologies unveils Eyeonic Vision System Mini

Power

Nexperia unveils new LCD bias power ICs for display devices

Electronics

Crypto Quantique and iMQ to enable quantum secure chip-to-cloud connection

Consumer

CES 2024 - e-peas launches first Energy Harvesting PMICs optimised for RCU and KBD designs