Engineering publications brought to you by Mark Allen

Neil Tyler

Distribution

TTI Europe shipping TE Connectivity’s high-voltage connectors for E-mobility applications

Automotive

onsemi opens systems application lab for electric vehicles in Europe

Power

Infineon extends CoolSiC portfolio with industry-standard package

Embedded & Programmable

QuickLogic unveils enhanced Aurora FPGA/eFPGA user tools

Board Level Design

Cadence and Autodesk collaborate on smart product design

Security

Secure-IC’s Securyzr technology integrated into MediaTek's Dimensity 9300

Electronics

Evonik to build first plant in North America for ultra-pure colloidal silica

Test & Measurement

SIGLENT releases new flagship SDS7000A oscilloscope

Power

Toshiba launches first 30V N-Channel Common-Drain MOSFET

EDA & Design Software

Synopsys.ai Copilot to accelerate chip design

Energy & Environment

UK to offer higher subsidies for offshore windfarms

Electronics

X-FAB introduces enhanced SPAD devices focused on near-infrared applications