Engineering publications brought to you by Mark Allen

Neil Tyler

Memory

Quinas Technology’s ULTRARAM wins Memory Technology Award

Manufacturing

Relationship building

Interconnection

Cinch Connectivity Solutions unveils mmWave Angled 30-degree product family

Power

Infineon adds to OptiMOS 5 portfolio targeting high power ECUs

Power

Transphorm’s GaN hits short circuit robustness milestone

Electronics

First 4-inch aluminium nitride substrate

Electronics

Semiconductor companies look to drive RISC-V ecosystem and hardware development

Embedded Software

SEGGER releases the Flasher Hub-12

Memory

Winbond earns ISO/SAE 21434 certification for W77Q Secure Flash

Communications Hardware

Keysight supporting Stuttgart University’s advanced 6G integrated circuits research

Board Level Design

THERM-A-GAP GEL 50TBL, a dispensable thermal gel for thin bond line applications

Electronics

TSMC commits to German fab