Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

Analog Devices invests $1bn expanding Oregon semiconductor facility

Automotive

onsemi and Magna sign long-term SiC supply agreement

Interconnection

High-power Harwin connector series benefits from 360° EMC backshells

Interconnection

Rugged IP67 & IP68 USB-C connectors from Live Electronics

Artificial Intelligence

A new AI industry body

Memory

Micron delivers fast, high- capacity HBM advancing generative AI innovation

Artificial Intelligence

NeoLogic raises $8 million in latest seed round

Distribution

Mouser stocking u-blox’s ZED-F9P-GNSS module for AVs and robotics

Space

Leaf Space receives funding as it strives towards seamless satellite connectivity

Power

Infineon extends its PQFN 2x2 mm² product portfolio

Skills & Careers

Arm announces new global skills initiative

Internet of Things

Intrinsic ID announces QuiddiKey 100 for Internet connected devices