Engineering publications brought to you by Mark Allen

Neil Tyler

Internet of Things

Soil health intelligence achieved

Displays

NXP brings GaN to 5G multi-chip modules

Displays

Anritsu, Spirent and TOYO develop solution for evaluating 5G video quality

Displays

Qualcomm looks for mmWave boost

Passive Components

Rear panel mount options for Harwin's hi-rel cable connector products

Communications Hardware

OMC delivers flexible fibre optic housing

Manufacturing

Teledyne expands technical support for its ADC series

Displays

Porotech raises £3m for new generation of microdisplays

Manufacturing

Neurala raises $12m to scale AI for industrial manufacturing

Wireless Technology

Ceva unveils ultra-wideband platform IP

Automotive

Cadence and Presto Engineering collaborate on IC packaging

Automotive

Melexis unveils automotive 200-2000A current sensors