Engineering publications brought to you by Mark Allen

Neil Tyler

Embedded Systems

ARIES starts volume production of the M100PFS SoM

Aerospace

EPC announces radiation-hardened eGaN transistors and ICs

GF and GlobalWafers look to expand semiconductor wafer supply

CPUs

NXP offers beta UWB development tools for U1 chip supported products

Communications Hardware

Point 2 Technology introduces RangeXtender for 5G networks

Displays

NHN selects Graphcore IPU-PODs

Communications Hardware

Ranovus announces second-generation “co-packaged optics” chip

Communications Hardware

"Game changer" for optical telecom and data centre interconnect networks

Automotive

Silicon carbide MOSFET module solutions for charging EVs

Chip shortages expected until 2023

Embedded Systems

TT Electronics launches S-2CONNECT Creo SOM

Displays

InP lasers integrated into photonics process