Engineering publications brought to you by Mark Allen

Neil Tyler

Embedded Systems

congatec modules set new benchmarks for secure edge AI applications

Internet of Things

ST integrates Ceva Cellular IoT Platform in its NB-IoT industrial module

EDA & Design Software

Altair announces release of HyperWorks 2024

Consumer

Tough times for Dyson

Electronics

Samsung Electronics provides 2nm GAA process and 2.5D package to Preferred Networks

Research Design

Iceotope launches state-of-the art liquid cooling lab for data centres

Power

ROHM presents analogue-digital fusion control power supply solution

Power

Nexperia’s 650 V recovery rectifiers now in D2PAK Real-2-Pin packaging configuration

Power

Littelfuse ITV2718 battery protector series prevents Li-ion battery damage

Sensors

OMNIVISION unveils shutter image sensor for AR/VR/MR tracking cameras

Distribution

Farnell now stocking Murata's UWB and LoRa modules

EDA & Design Software

Siemens advances integrated circuit test and analysis at 5nm and below