Engineering publications brought to you by Mark Allen

Neil Tyler

Challenges ahead

Research Design

Supermicro collaborates with Intel on large scale distributed training AI systems

Automotive

First global mass production of smart eCockpits

Power

Toshiba launches compact resettable eFuse IC

Power

Flex Power Modules DC-DC converters target railway rolling stock

Automotive

Cree and STMicro extend SiC wafer supply agreement

Board Level Design

Future Facilities launches ‘fastest ever’ solver technology

Power

500W quarter brick DC-DC module supports GaN power amplifiers

Labour’s broadband policy

Wireless Technology

Infineon and Klika Tech to accelerate IoT and Cloud solutions development for smart buildings

EDA & Design Software

Supplyframe and Cadence integrate cloud-based PCB library service directly with PCB tools

CPUs

Temperature sensor accurate to 0.25°C from STMicroelectronics