Engineering publications brought to you by Mark Allen

Neil Tyler

Distribution

Anglia moves to support RoHS 3 compliance

Communications Hardware

Cadence unveils first silicon-proven, long-reach 7nm 112G SerDes IP

Board Level Design

ATE-Connect test technology set to dramatically speed up silicon debug and bring-up

Research Design

Imec and ASML announce EUV lithography collaboration

Automotive

UltraSoC and ResilTech partner to further functional safety in automotive systems

Displays

Vicor Iintroduces 10kW Power Tablet AC-DC converter

Wireless Technology

Silicon Labs accelerates low-power cellular IoT applications with LTE-M solution

Automotive

Rohde & Schwarz and Huawei successfully perform LTE-V interoperability tests

Board Level Design

BBC micro:bit hits milestone as 2m are distributed globally

Embedded Systems

Semiconductor boom

Optimism abounds at Qualcomm 4G/5G summit

Aerospace

Bridging the gap to the future