Engineering publications brought to you by Mark Allen

Neil Tyler

Board Level Design

Thermal engineers voice frustration with simulation software packages

Test & Measurement

NI unveils latest enhancements to LabVIEW NXG

CPUs

Littelfuse completes acquisition of IXYS

Distribution

Voice interfaces were prominent at this year's CES in Las Vegas

CPUs

Resurgence of interest in FPGAs helped by new services via the Cloud

Communications Hardware

ams extends digital multispectral offering

Automotive

Automotive qualified Zynq UltraScale+ MPSoC family from Xilinx

Automotive

Ford accelerates global development of electric vehicles

Optoelectronics

Advanced automotive touchscreen controller from Cypress

Manufacturing

Surface-mount design 12G-SDI BNC right angled connectors for broadcast and vision

Manufacturing

HI-TMP wet tantalum capacitors offer increased reliability

Communications Hardware

Wavy transistors deliver ultrahigh definition displays