Engineering publications brought to you by Mark Allen

Neil Tyler

Memory

KIOXIA’s UFS Ver. 4.0 embedded flash memory devices achieve SPICE CL2 certification

Electronics

Research into next generation, high-quality, low-cost infrared imaging

Electronics

SEMI publishes recommendations to help bolster EU's semiconductor ecosystem

Automotive

HORIBA MIRA partners with Monolith to enhance battery testing through AI

Skills & Careers

BAE Systems to recruit thousands of apprentices and graduates in 2025

Internet of Things

Morse Micro presents Wi-Fi platform for enhanced IoT connectivity

Electronics

Marvell expands strategic collaboration with AWS

Automotive

Configurable power-management IC from ST targets automotive microcontrollers

Interconnection

Amphenol RF extends its portfolio of FAKRA connectors

Electronics

SemiQon releases first CMOS transistor optimised for cryogenic conditions

Board Level Design

QPT develops power electronics packaging with better heat removal and greater reliability

Sensors

Celera Motion unveils Aura P packaged optical encoder