Engineering publications brought to you by Mark Allen

Neil Tyler

Power

Toshiba announces small intelligent power device for BLDC motor drives

Artificial Intelligence

FuriosaAI unveils new AI inference chip

Embedded Systems

AAEON signs Edge Impulse partnership agreement to grow edge AI market share

Internet of Things

Qualcomm and Sequans reach agreement on sale of 4G IoT technology

Interconnection

Hirose adds low profile version to One Action FPC Connector family

Sensors

OMNIVISION introduces small-format 50-megapixel image sensor

Security

Report says that promise of AI relies on scaling security as edge AI booms

Power

Nexperia expands power device portfolio with new ideal diodes

Consumer

Global notebook shipments expected to grow by 3.7% in 2024

RF & Microwave

Fairview Microwave unveils Wi-Fi 6e/7 omni and flat-panel antennas

Test & Measurement

dSPACE develops simulation solutions with CIM Database Cloud

Electronics

More than half of connected devices will be haptic enabled by 2028