Engineering publications brought to you by Mark Allen

Board Level Design

Toshiba and Japan Semiconductor develop versatile analogue platform

Soracom collaboration with Sony Semiconductor Solutions' SPRESENSE IoT MCUs

AIROC Wi-Fi/Bluetooth solutions available with Jetson Edge AI platform

Universal development board enables choice of MCU and peripherals

NXP delivers a Modular Platform to support industrial IoT development

Embedded systems superheroes at your service!

Nexperia expands Clip-bonded FlatPower packaged diodes with automotive CFP2-HP devices

Trackwise delivers FPC cell-connecting interconnect for EV batteries

Design, development and manufacture

Farnell signs distribution agreement with KUNBUS

Littelfuse battery protectors provide fast response

Penn State to lead study into radiation effects on electronics