Engineering publications brought to you by Mark Allen

Board Level Design

JEDEC-compliant temperature sensor for DDR5 modules

Lightweight aluminum backshells for D-sub connectors

Harting extends rear-mounted options

Siemens releases latest Simcenter FLOEFD software

Putting the spotlight on LED thermal design

Survey – UK electronics industry and COVID-19

Passives’ push for circuit integration

Mouser signs global distribution agreement with Essentra

Preview Development Kit for SoC nRF5340 from Nordic Semi

Fast mount NET-BOX wall mount enclosures

Microchip 'Hello FPGA' Kit simplifies FPGA development

The stretchy electronics revolution