Engineering publications brought to you by Mark Allen

Communications Hardware

Dialog unveils first IO-Link IC for Industry 4.0

AEC-Q101 N- and P-channel TrenchFETs

Highly integrated software-defined automotive cockpit

Huawei unveil 2nd generation of 5G CPE

Insight SiP introduces module for ranging applications

Intel announces latest 5G products in MWC absence

u-blox announces SARA-R4 security improvement

u-blox launches first Wi-Fi 6 module series in automotive grade

Imagination’s RF IP included in Autotalks’ PLUTON2 Chipset

Qualcomm launches Snapdragon X60 5G modem-RF system

Imagination announces new iEB110 Bluetooth Low Energy v5.2 IP

Filtronic launches generation E-band transceiver module