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Motor control development kit

Rockley to open Irish photonics R&D centre

GF takes 90nm silicon photonics to 300mm wafers

Bendable silicon wafer is just 15µm thick

Augmented reality could be a game changer in PCB design

Network providers take centre stage at Mobile World Congress 2018

Harwin showcases robust and adaptable connectors to embedded audience

Short term Euro research future clarified, but questions remain

This girl can and did

Security report urges IoT manufacturers to ‘get smart’

Static electricity could power low energy devices

Modified, 3D-printable alloy shows promise for flexible electronics