Engineering publications brought to you by Mark Allen

Interconnection

Ranovus announces second-generation “co-packaged optics” chip

"Game changer" for optical telecom and data centre interconnect networks

CEA-Leti introduces plastic mmWave system

Third-generation 112G-LR SerDes IP

GUC announces GLink-3D Die-on-Die interface IP

STMicroelectronics looks to deliver protection for high-speed interfaces

Cadence unveils low-power IP for PCI Express 5.0 specification on TSMC N5 process

NeoPhotonics makes Class 60 versions of CDM and Micro-ICR available

Diodes adds to its range of linear ReDriver ICs

Diodes expands video passive multiplexer/demultiplexer switch portfolio

AMI qualifies Renesas' I3C bus extension products

MIKROE launches its 1000th Click board