New Electronics

Race to develop AI chips ‘hots up’

Molex targets data centres with ‘Plug and Play’ VersaBeam EBO interconnect solutions

AI platform enables customisable packaging solutions for AI applications

Zuken signs agreement to join IBM Research AI Hardware Center

MediaTek’s Genio 720 and Genio 520 IoT platforms target generative AI applications

Toshiba unveils latest version of its Motor Control Studio software

Renesas introduces Bluetooth Low Energy SoC for automotive applications

Brite Semiconductor releases DDR3/4, LPDDR3/4 Combo IP

Shaping future cable assemblies

Microchip’s PolarFire SoC FPGAs achieve AEC-Q100 qualification

New semiconductor design centre strengthens UK chip design capabilities

EU Project to deliver breakthrough in space imaging sensing