Engineering publications brought to you by Mark Allen

Artificial Intelligence

Semiconductor packaging material market set to return to growth in 2024

Serial consumers

BrainChip introduces low-power AI acceleration co-processor

Monolith and NIO Europe begin AI-driven anomaly detection for EV batteries

Sony Semiconductor Solutions and Raspberry Pi launch Raspberry Pi AI Camera

Time to take the plunge

Siemens extends collaboration with TSMC to advance IC and systems design

TSMC and Cadence to deliver advanced-node design flows and 3D-IC solutions

SK hynix begins volume production of 12-Layer HBM3E

Broadcom delivers 200G/lane DSP for Gen AI infrastructure

Samsung develops automotive SSD based on 8th-generation V-NAND

Renesas develops power-efficient 4th-generation R-Car automotive SoCs