Engineering publications brought to you by Mark Allen

Board Level Design

Heated conundrum

New holder for STYLE-CASE handheld enclosures

RS introduces advanced Diablo16- and Picaso-based LCD modules

Designing with, not for manufacturing

Zuken introduces new solution for 3D harness design optimisation

China aims high as global innovator

Embedded World: Future launches its SPINnaker board

Pixus offers six new configurations of 6U OpenVPX backplanes

iMOTION IMM100 series reduces PCB size

Embedded World 2019

P2i’s Dunkable gives industry’s highest levels of liquid protection

Bulgin launches programmable smart connector for harsh environments