Engineering publications brought to you by Mark Allen

Memory

NAND to see 40% growth in 2020

Complying with the latest standards

Micron launches first QLC solid-state drive

Amass DC power connectors

Scientists report breakthrough with a new generation of electronics

Micron targets performance and battery life in 5G smartphones

Winbond unveils industry-first x64 LPDDR3 memory chip

CryptoAuthentication token enhances embedded cybersecurity

Winbond provides end-to-end security for IoT devices

Next-generation memory targets AI and 5G applications

Samsung unveils Gen 3 high-bandwidth flash

Hardened single-chip synchronous buck and LDO for space applications