Engineering publications brought to you by Mark Allen

Memory

BiSb expands the potential of topological insulators for ultra-low-power electronic devices

Green Hills and Paragon Software to deliver safe and secure IVI system

Toshiba Memory Europe announces 96-layer BiCS FLASH development

Micron and Intel announce update to 3D XPoint joint development program

Overshooting 3D NAND flash market demand is high and growing, says IC Insights

An introduction to using Linux on embedded single-board computers

Fujitsu announces FRAM with a capacity of 8Mbit

Samsung launches NVMe SSD based on next generation small form factor

Chip upgrade helps miniature drones navigate

Imec demonstrates manufacturability of state-of-the-art spin-orbit torque MRAM devices on 300mm Si wafers

Long-term DDR3 memory module supply chain solution

Does NVMe Make Sense for Embedded?