Engineering publications brought to you by Mark Allen

CPUs

Silicon Labs modules provide pre-certified wireless connectivity

Dialog partners with Alps Alpine for automotive haptic applications

Prototyping platform brings microelectronics and fluid handling together

Renesas and Sequans announce 4G/5G cellular IoT collaboration

Flex Logix unveils AI edge inference chip

NXP extends secure ultra-wideband portfolio

MCUs integrate configurable analogue and digital peripherals

ST unveils features of latest automotive microcontrollers

NXP expands its Scalable Machine Learning portfolio

GreenWaves announces next generation GAP9 hearables platform

Taking technology to the next level

Bridgetek’s EVE technology supports higher resolution displays