Engineering publications brought to you by Mark Allen

Semiconductors

PillarHall test chip able to analyse 3D thin film structures

Outlook 2021: Accelerated digitalisation

Morse Micro raises an additional $13 million

Outlook 2021: Getting smarter, connected and more secure

Mouser stocking Renesas’ RA6M4 MCUs

ST and Schneider Electric use AI to deliver advanced people-counting solution

Xilinx and TI cooperate on 5G solutions

SEGGER’s embOS RTOS transforms 64-bit SoCs into single chip computers

AMD Ryzen embedded V2000 processors

Teledyne e2v space processor passes100krad TID testing

Microchip unveils first 8-bit MCU family for CAN FD networks

Mythic launches AI analogue matrix processor