Engineering publications brought to you by Mark Allen

Semiconductors

ST simplifies sustainable product design with USB Type-C power delivery software

Alchip developed ASIC CPU delivers record-setting server performance

Novatek adopts CEVA’s Sensor Hub DSP for multi-sensor IP camera SoC

R&D collaboration optimises tools for the design of power modules

Codasip and Intel bring RISC-V development to higher-education

Tachyum takes further step towards a production ready Prodigy processor chip

Xiphera launches Quantum-Secure Cryptographic IP cores

ST and Soitec cooperate on SiC substrate manufacturing technology

USC’s MOSIS and SkyWater deliver silicon IC design and manufacturing service

ROHM develops ultra-low-power on-device learning Edge AI chip

Imperas and Andes collaborate to support RISC-V innovations

POLYN Technology signs first customer for NASP Tiny AI chips