Engineering publications brought to you by Mark Allen

Electronics

A 7-point 'Plan for Success' for the UK's semiconductor industry

Intelliconnect introduce the Q-CON cryogenic connector for quantum computing

SynSense advances neuromorphic audio processing with Xylo Audio 3 tapeout

Kerlink and The Things Industries announce strategic partnership

Infineon further extends its edge AI capabilities

Nuvoton unveils MUG51 8-bit MCU for battery-free devices

VR: The key enabler of the metaverse

sureCore and Universal Quantum announce tape-out of cryogenic IP demonstrator chip

ST GaN driver integrates galvanic isolation for superior safety and reliability

Teledyne e2v and Infineon partner on processor boot solution for edge computing space systems

ST reveals latest FlightSense multi-zone distance sensor

NFC Forum unveils NFC’s Technology Roadmap through 2028