Engineering publications brought to you by Mark Allen

Electronics

Amkor and GlobalFoundries establish new strategic partnership

AAEON extends embedded box PC line with the BOXER-6451-ADP

Filtronic automates wedge bonding for complex wire components

EnSilica to develop satellite communications chip for terminals

Winbond joins UCIe Consortium to support chiplet interface standardisation

PCAP touch panels for outdoor applications

AI remains a ‘sea of dudes’

Arctic Semiconductor ships IceWings, its first 5G RF chipset

ServCity consortium brings autonomous mobility a step closer to deployment in UK’s cities

The Six Semiconductor announces tape-out of two 7nm test chips

Tachyum validates Prodigy Universal Processor with Kubernetes

Oculi forms strategic partnership with GlobalFoundries