Engineering publications brought to you by Mark Allen

Electronics

Molex introduces solution for co-packaged optics

MEMS market seen growing at 9% CAGR through to 2027

Renesas extends RISC-V Embedded Processing portfolio

Flexible power modules from ST look to simplify SiC inverter designs

OrionVM and Blaize bring edge computing and AI to the cloud

Nexeon awarded funding for silicon materials scale-up

StoreDot starts shipping EV battery cell samples for testing with automotive manufacturers

Omron adds DC relays for automotive and mobility applications

Intrinsic ID collaborates with Synopsys to boost SoC security

Hirose expands hybrid FPC-to-board connector offering

Magnachip unveils third-generation 200V MV MOSFETs

High-performance, small-size TFT display modules