Engineering publications brought to you by Mark Allen

Electronics

CEVA expands sensor fusion product line with new sensor hub MCU

Toshiba and Japan Semiconductor develop versatile analogue platform

Texas Instruments remains world's top analogue IC supplier

Intrinsic ID’s SRAM PUF security IP made available for Intel FPGAs

Mouser now stocking UF4C/SC 1200V Gen 4 SiC FETs

First ISO26262-compliant high-resolution 3D image sensor for automotive

Toshiba extends miniature MOSFET gate driver family for portable applications

ST’s latest NFC readers accelerate payment and consumer application designs

Percepio introduces DevAlert Sandbox

Renesas to acquire Reality AI

Winbond TrustME W77Q Secure Flash obtains SESIP Level 2 Certification

Memfault and NXP to accelerate development and improve IoT products in the field