Engineering publications brought to you by Mark Allen

Electronics

SECO and NXP collaborate to bring Clea to industrial and IoT applications

Taking test to the next level

Amazon pours additional $2.75bn into Anthropic

Winbond extends secure flash family with new memory densities andPQC support

NXP introduces the Open S32 CoreRide platform

Silicon Motion unveils latest generation FerriSSD BGA SSD

SEMIFIVE commences mass production of 14nm AI inference SoC platform

Pragmatic opens UK’s first 300nm semiconductor wafer manufacturing facility

New Beagle ready to pre-order from Farnell

Mouser signs distribution agreement with Vox Power

Achronix FPGAs add support for Bluespec’s Linux-capable RISC-V soft processors

New fabrication process, a major advance towards quantum computing