Engineering publications brought to you by Mark Allen

Electronics

NXP’s S32K3 automotive MCUs ready for AWS cloud services

Renesas partners with EdgeCortix to streamline AI/ML development

CUI Devices launches thermal design services

HMD starts manufacturing 5G smartphones in Europe

Microchip’s RT PolarFire FPGA achieves QML Class Q qualification

Delivering state-of-the-art chip designs

Apple announces plans to hire UK AI staff

Exeger and Matrix Industries to develop low-power solutions for electronic devices

Siemens and TSMC collaborate on optimising latest process technologies

SiGe BiCMOS optical receiver achieves data rate of 200 Gbps

RS augments its Think Hub digital platform

HORIBA MIRA opens Driving Simulator Centre