Engineering publications brought to you by Mark Allen

New Electronics

Nexperia’s 650 V recovery rectifiers now in D2PAK Real-2-Pin packaging configuration

Littelfuse ITV2718 battery protector series prevents Li-ion battery damage

OMNIVISION unveils shutter image sensor for AR/VR/MR tracking cameras

Farnell now stocking Murata's UWB and LoRa modules

Siemens advances integrated circuit test and analysis at 5nm and below

Applied Materials unveils chip wiring innovations

Microchip expands processing portfolio with multi-core 64-bit MCUs

COM-HPC modules support 12th and 13th generation Intel Core processors

US-JOINT consortium to develop advanced semiconductor packaging

Kicking the e-waste habit

Europe seeks industry views on China's older generation chips

Global semiconductor sales jump 19.3% in year to May