Engineering publications brought to you by Mark Allen

New Electronics

Sondrel announces Advanced Modelling Process for AI chip designs

TASKING enhances tools support for NXP automotive microcontrollers and processors

Tenstorrent and Movellus to enable next-generation chiplet-based AI and HPC solutions

GlobalFoundries becomes Silicon Catalyst Partner

How connected tools are redefining construction and assembly sites

Magnachip expands automotive power line with 40V MXT MV MOSFETs

Intel and IBM set to deliver enterprise AI in the Cloud

DELO demonstrate reliability of adhesives as soldering alternative for miniLEDs

Advanced substrate market set for solid growth

Schneider Electric to invest £42 million in new manufacturing site in North Yorkshire

Blue Cheetah and LG demonstrate successful silicon bring-up of chiplet-based design

First 800G ZR/ZR+ pluggable modules for 500km data centre interconnects