Engineering publications brought to you by Mark Allen

New Electronics

OKdo and Google establish distribution partnership for Coral platform

Farnell strikes global agreement with NI

Dual-polarized H/V omni antenna

Secure-IC and Menta look to optimise embedded cybersecurity

NXP releases Wi-Fi 6E Tri-Band chipset for access devices

Alpha-Omega Technology incorporates LoRaWAN into smart meters

Anglia Components signs distribution agreement with Abracon

Intel outsources15-20% of its non-CPU chip production

Flat aluminum electrolytic capacitors withstand 150°C and 80g vibration

Cepton introduces lidar sensor for near-range applications

Andes Technology and Rafael Microelectronics announce strategic partnership

Hailo licenses NoC IP to accelerate dataflow performance