Engineering publications brought to you by Mark Allen

Semiconductors

Codasip partners with SmartDV to accelerate chip design projects

MediaTek dominates 4G smartphone chipset market

AMD to expand adaptive computing research, development and engineering operations in Ireland

Cirrus Logic looks to deliver an improved audio experience

CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers

Chips all round

Panmnesia presents enhanced AI vector search system

Achronix unveils 400 GbE and PCIe Gen 5.0 for SmartNICs

Alphawave Semi expands collaboration with Samsung, adds 3nm connectivity IP

Global 300mm fab equipment spending to reach $119bn in 2026

Nanusens secures first IP license for its MEMS-in-ASICs sensor technology

A £1 billion strategy for the UK’s semiconductor sector