Engineering publications brought to you by Mark Allen

System Design

POLYN Technology and Edge Impulse look to advance Tiny AI products

Renesas ‘Ready Partner Network’ extended across all MCUs and MPUs

Outlook 2023: The Age of Inference

Meaningful shrinkage

Inova Semiconductors presents high performance data architecture

OMNIVISION and AdaptivEndo to provide unified platform for endoscopes

Rambus delivers PCIe 6.0 Interface subsystem for data centre and AI SoCs

u-blox announces secure high-precision dual-band GNSS timing module

What we can learn from the energy efficiency of supercomputers?

Microchip unveils Arm-based PIC MCU making it easier to add Bluetooth LE connectivity

Infineon working with Cerence to enable ‘the hearing car’

NXP OrangeBox unifies automotive wireless connectivity