Mark Liu, president and co CEO, claimed on the conference call that TSMC's 7nm technology development is 'well on track' and that it is 'ahead of our competition'. However, the next generation process – 5nm – has now entered technology development, which is one step away from production. Interestingly, Liu said EUV lithography will be used 'extensively' at the 5nm node.
This is probably the most bullish statement made yet about EUV. Originally intended for use at the 32nm node, a range of problems has kept EUV on the sidelines. Last year, TSMC said it had 'firm plans' to get EUV working at the 5nm node, although – like others working at the 'bleeding edge' – it had yet to get EUV working in a way that made economic sense. But, according to Liu, EUV technology development has recently made 'good progress'. "The throughput and reliability of EUV scanners, the sensitivity of EUV photoresist and the quality of EUV mask blank and the pellicles all improved."
Nevertheless, Liu added a caveat: "Of course, there's still a way to go."
One of the descriptions of EUV has been that it's 'tomorrow's technology - and always will be'. Perhaps, after all the R&D effort invested in the approach, EUV is about to fulfil the expectations - even if it's several years late to the party.
