Engineering publications brought to you by Mark Allen

Automotive

EBV and Maxim sign EMEA distribution agreement

SBC based on Intel Skylake H Series processor

Development kit for prototyping mid-air haptic technology

Current sensor ICs with high precision programming

Microcontrollers complete with core independent peripherals

OUTLOOK 2017: Making it safe to connect

OUTLOOK 2017: The yin and yang of multicore

OUTLOOK 2017: A system level view of automotive requirements

OUTLOOK 2017: Design engineers; use your distributor as a knowledge centre

OUTLOOK 2017: Next generation stacked cell structures and new standards are taking flash memory into the future

OUTLOOK 2017: You’ve got to be in it …

OUTLOOK 2017: USB-C: Back to the future