Engineering publications brought to you by Mark Allen

Embedded Systems

CES 2020 - CEVA's SenslinQ Platform to streamline development of contextually aware IoT devices

CES 2020 - “World’s smallest” 3D image sensor

Teraki raises $11mn to meet exploding data challenges

Wingtech takes controlling stake in Nexperia

Hot-swap connector

UltraSense Systems launches new touch user interface

Scalable and sustainable IoT

Compilers adopt new shapes

Human robot interaction

Wind River announces RISC-V support for VxWorks RTOS

Toshiba launches general-purpose system power ICs for automotive applications

CEA-Leti fabricates solid inorganic thin-film batteries