Engineering publications brought to you by Mark Allen

Embedded Systems

Spin Transfer Technologies PSC structure positions MRAM as the leading memory for mobile, datacentres and AI

Cadence prototypes first IP interface in silicon for preliminary version of DDR5 standard being developed in JEDEC

TI expands lead among last year’s top analogue suppliers

58VIN, 4A, low EMI, EN55022 B compliant µModule regulator

Power Integrations’ SCALE gate drivers available with conformal coating

A roadmap for energy storage on board armoured vehicle

Two weeks to go until PCB Design & Manufacturing Live

Ultracapacitor and battery-powered DC UPS

One step closer to flexible TVs and high performance wearables

Cadence and Plexus join PCB Design & Manufacturing Live seminar line-up

Robot developed for automated assembly of designer nanomaterials

Design a switch mode power supply using an isolated flyback topology